A technical showcase of embedded systems, circuit architectures, and custom hardware designs.
Note on Confidentiality: Due to strict Non-Disclosure Agreements (NDAs) with our clients, specific product branding and proprietary schematics are withheld. The following technical highlights showcase our engineering scope and core architectures.
Advanced hardware solutions engineered for high performance, reliability, and precision control.
Compact form-factor hardware module designed for seamless multi-protocol wireless integration into broader carrier systems.
Core Architecture: Built around the Texas Instruments CC2652P7 high-performance multi-protocol wireless microcontroller supporting Bluetooth Low Energy (BLE), Thread, and Zigbee.
Engineering Highlights: Ultra-low power consumption profile, optimized RF trace antenna layout for maximum signal range, and castellated stamp-hole pad configuration for robust surface-mount integration.
Handheld or field-deployed data logging unit engineered for high-precision pressure telemetry and flexible bus topology.
Core Architecture: Integrated single-cell Li-ion battery charger with hardware-level fuel gauging, USB-C compliance for power delivery and data sync, and high-contrast 7-segment LED status indicators.
Engineering Highlights: Features wireless BLE telemetry alongside a physical-layer daisy-chain topology, allowing multiple slave acquisition modules to link reliably with a master controller unit.
High-speed, real-time embedded control system designed for specialized pneumatic therapy equipment.
Core Architecture: Powered by the high-performance STM32H750X ARM Cortex-M7 MCU, augmented with external SDRAM memory expansion and a high-resolution RGB LCD graphic user interface.
Engineering Highlights: Real-time pressure sensor data reading, closed-loop proportional solenoid valve control, and custom high-efficiency pump driver circuitry for precise pneumatic pressure regulation.
Harsh-environment monitoring hub integrating multi-sensor acquisition with cloud-connected cellular and LoRaWAN backhaul.
Core Architecture: Wide-input DC-DC power regulation (9V-36V protection), transient voltage suppression (TVS), and a custom-molded 3D CAD polymer enclosure designed for DIN-rail mounting.
Engineering Highlights: Thermal management simulations to prevent hot spots inside sealed enclosures, IP65 ingress protection validation, and robust EMI/EMC filtering for heavy industrial floors.
Miniaturized biometrics tracker balancing strict space constraints with ultra-low power longevity.
Core Architecture: Rigid-flex multi-layer PCB design combining optical sensor front-ends with an ultra-low power ARM Cortex-M4 core and internal coin-cell battery management.
Engineering Highlights: Ergonomic industrial casing design optimized for skin-contact comfort, drop-resistance modeling, and ultra-compact surface-mount component packing density.
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